Samsung emblem displayed on a glass door on the firm’s Seocho constructing in Seoul on July 7, 2022. Samsung Electronics has begun functions for tax breaks for 11 potential chip vegetation in Texas including as much as investments of about $192 billion, based on paperwork filed with Texas authorities.
Jung Yeon-je | Afp | Getty Images
Samsung Electronics on Tuesday mentioned it has developed a brand new high-bandwidth reminiscence chip that has the “highest-capacity to date” within the trade.
The South Korean chip big claimed the HBM3E 12H “raises both performance and capacity by more than 50%.”
“The industry’s AI service providers are increasingly requiring HBM with higher capacity, and our new HBM3E 12H product has been designed to answer that need,” mentioned Yongcheol Bae, govt vice chairman of reminiscence product planning at Samsung Electronics.
“This new memory solution forms part of our drive toward developing core technologies for high-stack HBM and providing technological leadership for the high-capacity HBM market in the AI era,” mentioned Bae.
Samsung Electronics is the world’s largest maker for dynamic random-access reminiscence chips, that are utilized in shopper units comparable to smartphones and computer systems.
Generative AI fashions comparable to OpenAI’s ChatGPT require giant numbers of high-performance reminiscence chips. Such chips allow generative AI fashions to recollect particulars from previous conversations and consumer preferences so as to generate humanlike responses.
The AI increase continues to gasoline chipmakers. U.S. chip designer Nvidia posted a 265% soar in fourth fiscal quarter income because of skyrocketing demand for its graphics processing models, 1000’s of that are used to run and practice ChatGPT.
During a name with analysts, Nvidia CEO Jensen Huang mentioned the corporate might not have the ability to preserve this degree of progress or gross sales for the entire yr.
“As AI applications grow exponentially, the HBM3E 12H is expected to be an optimal solution for future systems that require more memory. Its higher performance and capacity will especially allow customers to manage their resources more flexibly and reduce total cost of ownership for datacenters,” mentioned Samsung Electronics.
Samsung mentioned it has began sampling the chip to prospects and mass manufacturing of the HBM3E 12H is deliberate for the primary half of 2024.
“I assume the news will be positive for Samsung’s share price,” SK Kim, govt director of Daiwa Securities, informed CNBC.
“Samsung was behind SK Hynix in HBM3 for Nvidia last year. Also, Micron announced mass production of 24GB 8L HBM3E yesterday. I assume it will secure leadership in higher layer (12L) based higher density (36GB) HBM3E product for Nvidia,” mentioned Kim.
In September, Samsung secured a deal to produce Nvidia with its high-bandwidth reminiscence 3 chips, based on a Korea Economic Daily report, which cited nameless trade sources.
The report additionally mentioned that SK Hynix, South Korea’s second-biggest reminiscence chipmaker, was main the high-performance reminiscence chip market. SK Hynix was beforehand referred to as the only real mass producer of HBM3 chips provided to Nvidia, the report mentioned.
Samsung mentioned the HBM3E 12H has a 12-layer stack, however applies superior thermal compression non-conductive movie which permits the 12-layer merchandise to have the identical top specification as 8-layer ones to satisfy present HBM package deal necessities. The result’s a chip that packs extra processing energy, with out rising its bodily footprint.
“Samsung has continued to lower the thickness of its NCF material and achieved the industry’s smallest gap between chips at seven micrometers (µm), while also eliminating voids between layers,” mentioned Samsung. “These efforts result in enhanced vertical density by over 20% compared to its HBM3 8H product.”
Source: www.cnbc.com”